Henchman Industries
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Alternative to SN100C Solder Bar, totally compatible can be added to existing solder baths



Product Description

Pressure from marketing and legislation in both Europe and Asia have forced electronics manufacturers to move away from lead-based solders. Typical lead-free alloys contain 3-4% silver, which can be costly. In addition to cost concerns, typical Tin/Silver/Copper (or SAC) alloys also present issues with increased dissolution of Copper from boards and components during the soldering process. As an example, SAC305, one of the industry's most popular lead-free wave soldering alloys, is known to dissolve Copper at a rate more than twice as fast as Sn63Pb37.

In response to demand for a low cost and low copper dissolution alloy, Kester has developed Ultrapure® K100LD. Kester K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.

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The accelerated rate of Copper dissolution has caused difficulties for electronic assemblers due to Copper terminal erosion and also elevated Copper levels in wave soldering pots. In particular, the elevated Copper levels in wave soldering pots can make the alloy flow more sluggishly, creating additional defects if the solder pot is not carefully controlled.

Kester K100LD compares favorably to other low-cost, lead-free alloys of tin and copper in terms of wetting and flow characteristics

• Low cost, lead-free alloy

• Bright, smooth solder joints with no visible shrinkage effects

• Excellent through-hole penetration and topside fillet

• Low dissolution of copper from boards and components into solder pot

• Eutectic alloy

• 20% Lower dross rate than Sn63Pb37 in laboratory tests

• Less corrosive to solder pots than SAC305

Process Information

Suitable for wave, selective and dip tinning operations. Use Kester fluxes 985M, 979, 959T, 2220-VF, 2235 for optimum wave soldering. Pot temperatures range for wave and dip tinning is 260-270°C.

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